Packaging Research And Development Engineer

Intel

Phoenix, Arizona, United States
Base: $133,800.00-219,550.00 usd; bonus/equity: st...
Process and material development
Factory floor interaction
Equipment/material suppliers
Join a world-class first of a kind embedded die packaging facility and learn advanced substrate manufacturing know-how

Job Summary

  • Join a world-class first of a kind embedded die packaging facility and learn advanced substrate manufacturing know-how.
  • Drive disruptive technology innovations and be part of creating history in the substrate packaging industry.
  • We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and comprehensive benefit programs.

Matching Summary

Join a world-class first of a kind embedded die packaging facility and learn advanced substrate manufacturing know-how.

Salary

Base: $133,800.00-219,550.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Process and material development
  • Factory floor interaction
  • Equipment/material suppliers
  • Statistical data analysis
  • Integrated process flow definition

Nice-to-have

  • Work with ambiguity
  • Flexibility with job roles
  • Cross-functional team participation
  • Continuous process improvements

Key Requirements

  • PhD degree in relevant field
  • Minimum 3 months experience statistical analysis
  • Minimum 3 months experience Python or ML
  • 1+ years experience troubleshooting
  • 1+ years experience SPC PCS RFCs
  • 1+ years experience organic/inorganic materials
  • 1+ years experience JMP and JSL

Work Rights

Not specified

Tailored Resume

Cover Letter