Metal Packaging Process Support Engineer

Applied Materials

Hwaseong, South Korea
Master's or bachelor's degree in materials science
3-10 years experience in semiconductor process engineering
Hands-on experience with physical vapor deposition (pvd)
This role provides high-visibility technical support for Applied Materials PVD/EP equipment in advanced semiconductor packaging environments

Job Summary

  • This role provides high-visibility technical support for Applied Materials PVD/EP equipment in advanced semiconductor packaging environments.
  • The engineer will design and execute process experiments, analyze results using statistical methods, and generate clear technical reports.
  • Candidates will collaborate closely with customers and R&D teams to develop leading-edge processes for next-generation semiconductor technologies.

Matching Summary

This role provides high-visibility technical support for Applied Materials PVD/EP equipment in advanced semiconductor packaging environments.

Skills & Requirements

Must-have

  • Master's or Bachelor's degree in Materials Science
  • 3-10 years experience in semiconductor process engineering
  • Hands-on experience with Physical Vapor Deposition (PVD)
  • Experience with Electro Plating (EP) processes
  • System-level experience with Endura / Charger platforms
  • Strong root cause analysis and troubleshooting skills

Nice-to-have

  • Excellent communication and interpersonal skills
  • Ability to work in physically demanding fab environments
  • Mentorship of junior engineers
  • Collaborative team environment
  • Innovation-focused work culture

Key Requirements

  • Master's or Bachelor's degree in Materials Science or related field
  • 3-10 years of experience in semiconductor process engineering
  • Proficiency in English for technical documentation
  • Prior on-site customer support or field engineering experience

Work Rights

Not specified

Tailored Resume

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