Equivalent hourly rate of $159,700 - $230,000 usd;...
10+ years semiconductor assembly experience
Osat manufacturing environment expertise
Flip-chip bga and substrate technologies
This role leads technical engagement with global OSAT suppliers to ensure world-class backend manufacturing performance for next-generation programmable devices
Job Summary
This role leads technical engagement with global OSAT suppliers to ensure world-class backend manufacturing performance for next-generation programmable devices.
The engineer will drive new product introduction activities while optimizing packaging architectures for performance, cost, and reliability across flip-chip and wire bond processes.
Candidates must possess strong data-driven analysis skills to monitor backend yield performance and lead corrective actions for systemic issues.
Matching Summary
This role leads technical engagement with global OSAT suppliers to ensure world-class backend manufacturing performance for next-generation programmable devices.
Salary
Equivalent hourly rate of $159,700 - $230,000 USD; Part-time position; Actual salary varies by location and experience
Skills & Requirements
Must-have
10+ years semiconductor assembly experience
OSAT manufacturing environment expertise
Flip-chip BGA and substrate technologies
Yield optimization and root cause analysis
NPI from engineering builds to production
Nice-to-have
FPGA or SoC high-pin-count experience
Automotive AEC-Q qualification knowledge
Advanced packaging 2.5D/3D familiarity
Supply chain risk mitigation strategies
Smart factory automation analytics
Key Requirements
Bachelor's degree in Electrical Engineering or related field
10+ years of semiconductor assembly, packaging, or test engineering experience