External Technology Integration Engineer

Intel

Phoenix, Arizona, US
Base: $155,520.00-298,440.00 usd; bonus/equity: st...
Hybrid
External memory integration
Foundry silicon integration
Advanced packaging platforms
Intel is shaping the future of technology to help create a better future for the entire world

Job Summary

  • Intel is shaping the future of technology to help create a better future for the entire world.
  • This role requires regular onsite presence to fulfill essential job responsibilities.
  • We offer a total compensation package that ranks among the best in the industry.

Matching Summary

Intel is shaping the future of technology to help create a better future for the entire world.

Salary

Base: $155,520.00-298,440.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, vacation

Skills & Requirements

Must-have

  • external memory integration
  • foundry silicon integration
  • advanced packaging platforms
  • chip-to-package interaction assessments
  • Si far back-end design rules
  • technical program management

Nice-to-have

  • thrive in ambiguous environments
  • executive audience communication
  • big data analysis leverage
  • model-based problem solving

Key Requirements

  • BA degree with 6+ years experience
  • Master's Degree with 4+ years experience
  • PhD Degree with 2+ years experience
  • 3+ years microelectronic packaging process development
  • 3+ years semiconductor packaging assembly management
  • 3+ years semiconductor supplier management

Work Rights

Not specified

Tailored Resume

Cover Letter