Principal/senior Engineer, Aptd Cem - Advanced Packaging Wafer Level Technology Engineering

Micron Technology

Wafer level process development
Wafer thinning and backside metal interconnect
Python r sql statistical analysis
The role focuses on developing and enabling deployment of processes related to post-fab wafer finishing in semiconductor manufacturing to meet performance and cost requirements

Job Summary

  • The role focuses on developing and enabling deployment of processes related to post-fab wafer finishing in semiconductor manufacturing to meet performance and cost requirements.
  • Candidates will work with peers across organizations to coordinate the development and launch of new technologies for solutions driving the future of AI and supercomputing.
  • Micron Technology is committed to integrity, sustainability, and giving back to communities while pursuing innovation in memory and storage solutions.

Matching Summary

The role focuses on developing and enabling deployment of processes related to post-fab wafer finishing in semiconductor manufacturing to meet performance and cost requirements.

Skills & Requirements

Must-have

  • Wafer level process development
  • Wafer thinning and backside metal interconnect
  • Python R SQL statistical analysis
  • Visual Basic automation experience
  • E3 FDC RMS equipment control

Nice-to-have

  • Strong data analytics capabilities
  • Continuous improvement mindset
  • Cross-functional collaboration skills
  • Root cause problem solving
  • Tenacity under tight timelines

Key Requirements

  • B.S/M.S./Ph.D. in Engineering or Physics
  • 2+ years semiconductor process development
  • Experience in wafer bonding and packaging

Work Rights

Not specified

Tailored Resume

Cover Letter