Develop and validate board assembly process solutions to meet Intel's next-generation product requirements, including creating SMT process solutions for Intel IC packages and sockets
Job Summary
Develop and validate board assembly process solutions to meet Intel's next-generation product requirements, including creating SMT process solutions for Intel IC packages and sockets.
Design and optimize SMT processes, evaluate and select materials, and collaborate with cross-functional teams to integrate new SMT processes into existing manufacturing lines.
Contribute to the development of technology roadmaps for SMT and PCB advancements, focusing on miniaturization, higher interconnect densities, and improved thermal and electrical performance.
Matching Summary
Develop and validate board assembly process solutions to meet Intel's next-generation product requirements, including creating SMT process solutions for Intel IC packages and sockets.
Skills & Requirements
Must-have
SMT process development
Printed Circuit Board (PCB) technology
Failure analysis and root cause
Materials characterization and selection
Prototype assembly and testing
Nice-to-have
Analytic problem solver
Good communicator
Experimenter
Discipline
Key Requirements
Bachelor's degree with 4+ years experience or Master's with 3+ years or PhD with 2+ years
Experience in Semiconductor IC assembly process and equipment
Understanding of material interaction with assembly processes