Ltd Be Etch Module Development Engineer

Intel

Hillsboro, Oregon, US
Base: $115,110.00-162,500.00 usd; bonus/equity: st...
Hybrid
Next-generation patterning process development
First-of-kind tool installation
Back end etch modules
You will be an integral contributor to next-generation patterning process development and First-of-Kind (FOK) tool installation, development, and qualification

Job Summary

  • You will be an integral contributor to next-generation patterning process development and First-of-Kind (FOK) tool installation, development, and qualification.
  • Work with cross-functional teams (e.g., Integration, Manufacturing, Equipment, Yield/Defect, and suppliers) to solve technical process and defect issues.
  • We offer a total compensation package that ranks among the best in the industry.

Matching Summary

You will be an integral contributor to next-generation patterning process development and First-of-Kind (FOK) tool installation, development, and qualification.

Salary

Base: $115,110.00-162,500.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Next-generation patterning process development
  • First-of-Kind tool installation
  • Back End Etch modules
  • Plan and conduct experiments
  • Process control systems development

Nice-to-have

  • Analyze complex technical issues
  • Self-directed and shows initiative
  • Strong communication skills
  • Collaborative mindset
  • Comfort working across multiple teams

Key Requirements

  • Master’s degree in STEM field
  • Experience with semiconductor process development
  • Experience planning and executing experiments
  • Willingness to work onsite regularly

Work Rights

Not specified

Tailored Resume

Cover Letter