Inspection Development Engineer

Intel Corporation

Kulim, Malaysia
Advanced chip packaging process technology
Packaging inspection technologies
Assembly and test development
Lead the development and deployment of Intel's advanced chip packaging process technology focusing on packaging inspection technologies across assembly, test, and finish processes

Job Summary

  • Lead the development and deployment of Intel's advanced chip packaging process technology focusing on packaging inspection technologies across assembly, test, and finish processes.
  • Establish metrology and defect inspection capabilities to accelerate process development and ensure effective outgoing quality screening aligned with the company roadmap.
  • Drive improvements in quality, reliability, cost, yield, process stability, productivity and safety/ergonomics while engaging in testing and validating hardware/software upgrades.

Matching Summary

Lead the development and deployment of Intel's advanced chip packaging process technology focusing on packaging inspection technologies across assembly, test, and finish processes.

Skills & Requirements

Must-have

  • Advanced chip packaging process technology
  • Packaging inspection technologies
  • Assembly and Test development
  • Metrology and defect inspection capabilities
  • Inspection process recipes
  • Material interactions understanding
  • Product Inspection module FMEA
  • New inspection capability assessment
  • Auto Inspection and Disposition (AID)
  • Machine Learning model development
  • Quality, reliability, cost, yield improvements
  • Hardware/software upgrade testing

Nice-to-have

  • Novel design solutions for manufacturing
  • Data science and statistics tools
  • Machine Vision techniques
  • Dimensional management for package features

Key Requirements

  • Bachelor's or Master's degree in Engineering, Physics, Computer Science or related STEM field
  • Fundamental physical processes troubleshooting
  • Ultra-high precision equipment troubleshooting
  • Optical, laser, motion or electrical systems expertise
  • Optics fundamentals for imaging techniques
  • Light-matter interaction understanding
  • Statistical principles, SPC, DOE knowledge
  • 6+ months of experience in Semiconductor Inspection
  • Optics fundamentals as applied to imaging techniques
  • Data science and statistics tools (Python preferred)
  • Data management and visualization experience
  • Machine Vision techniques, OpenCV experience
  • CNN Image Classification
  • Dimensional management for package features

Work Rights

Not specified

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