Advanced Ic Packaging Software Engineer

Intel

Phoenix, Arizona, US
Base: $111,030.00-211,200.00 usd; bonus/equity: no...
Hybrid
C/c++ programming experience
Experience with eda tools
Software design and architecture
Intel is a company of bold and curious inventors and problem solvers who create technological advancements

Job Summary

  • Intel is a company of bold and curious inventors and problem solvers who create technological advancements.
  • The Advanced IC Packaging Software Engineer will work closely with Intel foundry customers on advanced packaging technologies.
  • Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that improves lives.

Matching Summary

Intel is a company of bold and curious inventors and problem solvers who create technological advancements.

Salary

Base: $111,030.00-211,200.00 USD; Bonus/Equity: Not specified; Benefits: Competitive pay, stock bonuses, health, retirement, vacation

Skills & Requirements

Must-have

  • C/C++ programming experience
  • Experience with EDA Tools
  • Software design and architecture

Nice-to-have

  • Understanding of AI and ML fundamentals
  • Experience with Agile and Scrum practices
  • Effective communication skills

Key Requirements

  • Bachelor's Degree in Computer Science or related field
  • 2+ years of relevant experience
  • Master's Degree with 1+ years of experience preferred

Work Rights

Not specified

Tailored Resume

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