This role drives the end-to-end development of advanced substrate designs from concept through tape-out to ensure optimal performance and cost efficiency
Job Summary
This role drives the end-to-end development of advanced substrate designs from concept through tape-out to ensure optimal performance and cost efficiency.
The engineer will collaborate with cross-functional silicon and hardware teams to optimize pinout and package interactions for high-performance applications.
Intel offers a competitive total compensation package including stock bonuses, health benefits, retirement plans, and vacation time.
Matching Summary
This role drives the end-to-end development of advanced substrate designs from concept through tape-out to ensure optimal performance and cost efficiency.