Silicon Packaging Engineer - Wireless Communications Solutions

Intel

Hillsboro, Oregon, United States
Base: $141,910.00-200,340.00 usd; bonus/equity: st...
Onsite
2+ years package assembly technology development
2+ years packaging fea simulations mechanical thermal
2+ years package assembly manufacturing processes hvm ramp
Intel is seeking a Silicon Packaging Engineer to join its Wireless Communications Solutions team in Hillsboro, Oregon, focusing on advanced wireless technologies like Wi-Fi and Bluetooth. The role involves leading packaging architecture, conducting simulations, and collaborating across teams to drive innovation and ensure high-quality product development

Job Summary

  • This role drives cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products.
  • The position requires leading technology trade-off decisions to ensure packages meet electrical, mechanical, thermal, and reliability standards.
  • Intel offers a competitive total compensation package including stock bonuses, health benefits, and retirement programs.

Matching Summary

Match Score: 85

Intel is seeking a Silicon Packaging Engineer to join its Wireless Communications Solutions team in Hillsboro, Oregon, focusing on advanced wireless technologies like Wi-Fi and Bluetooth. The role involves leading packaging architecture, conducting simulations, and collaborating across teams to drive innovation and ensure high-quality product development.

Salary

Base: $141,910.00-200,340.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation

Skills & Requirements

Must-have

  • 2+ years package assembly technology development
  • 2+ years packaging FEA simulations mechanical thermal
  • 2+ years package assembly manufacturing processes HVM ramp

Nice-to-have

  • Experience working directly with external suppliers OSATs
  • Strong project management capabilities
  • Self-driven with strong problem-solving tenacity

Key Requirements

  • Bachelor's degree + 4+ years experience OR Master's + 3+ years OR PhD + 1+ year
  • US location (Oregon, Hillsboro) on-site presence required

Work Rights

Not specified

Tailored Resume

Cover Letter