The Texas Institute for Electronics (TIE) is a semiconductor consortium focused on 3D Heterogenous Integration manufacturing technology and pilot manufacturing capabilities
Job Summary
The Texas Institute for Electronics (TIE) is a semiconductor consortium focused on 3D Heterogenous Integration manufacturing technology and pilot manufacturing capabilities.
The Postdoctoral Fellow will conduct research in physics-informed Artificial Intelligence (AI) and Machine Learning (ML) methodologies enabling digital twin functionalities in microelectronics and advanced packaging.
The position offers competitive health benefits, generous paid time off, and participation in the Teachers Retirement System of Texas with employer matching funds.
Matching Summary
The Texas Institute for Electronics (TIE) is a semiconductor consortium focused on 3D Heterogenous Integration manufacturing technology and pilot manufacturing capabilities.
Salary
$70,000+ depending on qualifications
Skills & Requirements
Must-have
Develop multiscale and multiphysics modeling
Collaborate with experimental groups
Physics-informed AI/ML methodologies
Advanced packaging
Heterogeneous integration
Nice-to-have
Co-optimization and co-control of multistage manufacturing systems
Microelectronics packaging familiarity
Key Requirements
PhD earned within the last 3 years
Operations Research and Industrial Engineering or related discipline
Data analytics, AI, ML, advanced process control, digital twin technologies
Handling industrial big data problems
Advanced AI/ML software packages and super-computing cluster systems