Assembly Technician

Teledyne Technologies Incorporated

Not specified; not specified; competitive pyy + co...
High school diploma or equivalent
Steady hands for manual component placement
Ability to follow detailed written instructions
The role involves assembling discrete and multichip semiconductor packages while ensuring precise encapsulant dispensing and controlled curing

Job Summary

  • The role involves assembling discrete and multichip semiconductor packages while ensuring precise encapsulant dispensing and controlled curing.
  • Candidates must be self-motivated individuals who thrive on challenge and can work independently with minimal supervision.
  • The company offers competitive pay, comprehensive health benefits, a 401(k) with company match, and professional development opportunities.

Matching Summary

The role involves assembling discrete and multichip semiconductor packages while ensuring precise encapsulant dispensing and controlled curing.

Salary

Not specified; Not specified; Competitive pay and comprehensive health benefits

Skills & Requirements

Must-have

  • High school diploma or equivalent
  • Steady hands for manual component placement
  • Ability to follow detailed written instructions
  • Experience with microscopes and vacuum pens
  • U.S. Person status required

Nice-to-have

  • Mechanical aptitude and troubleshooting skills
  • Intermediate computer skills including MS Office
  • Knowledge of electrical/electronic components
  • Previous manufacturing experience
  • Adaptability in changing environments

Key Requirements

  • Must be a U.S. Person (citizen, LPR, refugee, or asylee)
  • High school diploma or equivalent required
  • No specific degree mentioned beyond high school

Work Rights

Must be a U.S. Person

Tailored Resume

Cover Letter