Senior Wire Bonding Manufacturing / Process Development Engineer

Teledyne Technologies Incorporated

Base: $113,600.00-$151,400.00; bonus/equity: not s...
Automated wire bonding processes
Process capability and compliance
Statistical analysis and doe
The role involves developing, optimizing, and sustaining automated wire bonding processes in microelectronics manufacturing

Job Summary

  • The role involves developing, optimizing, and sustaining automated wire bonding processes in microelectronics manufacturing.
  • The engineer will provide hands-on support to operators while collaborating with cross-functional teams.
  • Continuous improvement and compliance with quality standards are key aspects of this position.

Matching Summary

The role involves developing, optimizing, and sustaining automated wire bonding processes in microelectronics manufacturing.

Salary

Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • automated wire bonding processes
  • process capability and compliance
  • statistical analysis and DOE
  • production support and troubleshooting

Nice-to-have

  • experience in aerospace and defense
  • knowledge of high-reliability bonding
  • strong communication and training skills

Key Requirements

  • Bachelor’s degree in relevant field
  • 3+ years of relevant experience
  • ability to read technical drawings

Work Rights

Must have US citizenship

Tailored Resume

Cover Letter