The role involves developing first level/second level interconnect, thermal solutions, and SMT/PCB technologies to support Intel's future packaging platforms
Job Summary
The role involves developing first level/second level interconnect, thermal solutions, and SMT/PCB technologies to support Intel's future packaging platforms.
Candidates will collaborate with cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
The position offers a competitive compensation package including stock bonuses, health benefits, retirement plans, and vacation time.
Matching Summary
The role involves developing first level/second level interconnect, thermal solutions, and SMT/PCB technologies to support Intel's future packaging platforms.