$133,800.00-188,890.00 usd; not specified; not spe...
Hybrid
Process development and optimization
Equipment capability assessment
Statistical methodologies for process control
Drive innovation and shape the future of advanced IC packaging solutions by optimizing processes and equipment
Job Summary
Drive innovation and shape the future of advanced IC packaging solutions by optimizing processes and equipment.
Apply a strong understanding of process characterization, equipment capability, and statistical methodologies to enable manufacturability.
Contribute to Intel’s mission to deliver innovative, reliable, and manufacturable packaging solutions that power the next generation of semiconductor technology.
Matching Summary
Drive innovation and shape the future of advanced IC packaging solutions by optimizing processes and equipment.
Salary
$133,800.00-188,890.00 USD; Not specified; Not specified
Skills & Requirements
Must-have
Process development and optimization
Equipment capability assessment
Statistical methodologies for process control
Design of Experiments (DoE)
Panel level processes development
Nice-to-have
Data-driven problem solving
Cross-functional collaboration
Continuous learning and improvement
Adaptable to fast-paced environments
Key Requirements
Bachelor's degree in relevant engineering/science field
4+ years of experience in process development
Experience with DoE and statistical data analysis
Experience with process characterization and SPC
Experience with materials testing and characterization