Senior Wire Bonding Manufacturing / Process Development Engineer
Teledyne Technologies Incorporated
Base: $113,600.00-$151,400.00; bonus/equity: not s...
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Automated wire bonding processes
Statistical analysis and doe
Technical documentation creation
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Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing / Process Development Engineer to optimize and sustain automated wire bonding processes in microelectronics manufacturing. The role requires hands-on support and collaboration across functions, focusing on continuous improvement and compliance with quality standards.
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Job Summary
The role focuses on developing and optimizing automated wire bonding processes for microelectronics manufacturing.
The engineer will provide hands-on support and collaborate cross-functionally with various teams.
Continuous improvement and compliance with industry standards are key aspects of this position.
Matching Summary
Match Score: 75
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Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing / Process Development Engineer to optimize and sustain automated wire bonding processes in microelectronics manufacturing. The role requires hands-on support and collaboration across functions, focusing on continuous improvement and compliance with quality standards.
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Salary
Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Automated wire bonding processes
Statistical analysis and DOE
Technical documentation creation
Nice-to-have
Experience in aerospace and defense
Knowledge of high-reliability bonding requirements
Strong communication skills
Key Requirements
Bachelor’s degree in relevant field
3+ years of relevant experience
Proficiency with SPC and data-driven decision making