Failure Analysis (fa) Engineer

NXP USA INC.

Degree in microelectronics or physics
Digital and analog circuit fundamentals
Semiconductor device physics knowledge
The role involves interpreting test data and conducting bench-level testing to determine the failure mechanism of reported problems

Job Summary

  • The role involves interpreting test data and conducting bench-level testing to determine the failure mechanism of reported problems.
  • Candidates must reproduce electrical failures in a lab environment and locate defects using advanced tools like FIB, SEM, and OBIRCH.
  • Successful candidates will collaborate with Design, Test, and Manufacturing teams while documenting results in formal failure analysis reports.

Matching Summary

The role involves interpreting test data and conducting bench-level testing to determine the failure mechanism of reported problems.

Skills & Requirements

Must-have

  • Degree in Microelectronics or Physics
  • Digital and analog circuit fundamentals
  • Semiconductor device physics knowledge
  • Packaging processing understanding
  • Microscopic examination skills
  • Chemical and X-Ray tool usage

Nice-to-have

  • Laboratory or wafer fab experience
  • Microprobe measurement knowledge
  • Fault isolation techniques expertise
  • FA process flow familiarity
  • Teamwork and project management skills

Key Requirements

  • Masters degree in Microelectronics, Material Science, or Physics
  • Understanding of semiconductor packaging processing
  • Ability to work with chemicals and ion beam tools

Work Rights

Not specified

Tailored Resume

Cover Letter