Semiconductor Packaging Engineering Phd Intern

Intel

Phoenix, Arizona, US
Base: $99,700.00-134,800.00 usd; bonus/equity: not...
Experience with ai/ml techniques
Familiarity with molecular dynamics
Strong problem-solving skills
Join Intel as a Manufacturing Engineering Graduate Intern and contribute to shaping the future of semiconductor manufacturing

Job Summary

  • Join Intel as a Manufacturing Engineering Graduate Intern and contribute to shaping the future of semiconductor manufacturing.
  • This internship offers hands-on experience and project-based learning opportunities that align with Intel's mission to push the boundaries of innovation.
  • Explore your potential while gaining valuable skills and contributing to impactful business initiatives in a collaborative and dynamic environment.

Matching Summary

Join Intel as a Manufacturing Engineering Graduate Intern and contribute to shaping the future of semiconductor manufacturing.

Salary

Base: $99,700.00-134,800.00 USD; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Experience with AI/ML techniques
  • Familiarity with Molecular Dynamics
  • Strong problem-solving skills
  • Modeling with LAMMPS or Gromacs
  • Modeling large scale two phase flows

Nice-to-have

  • Proficiency in Design of Experiments
  • Experience in semiconductor packaging
  • Excellent communication and collaboration skills

Key Requirements

  • Pursuing a PhD in relevant fields
  • 4+ years of AI/ML experience
  • 4+ years of research in Molecular Dynamics
  • 4+ years in modeling with CFD/FEM software

Work Rights

Not specified

Tailored Resume

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