Apple is seeking a Silicon Photonics & Optical Packaging Engineer to develop innovative optical interconnect solutions for next-generation technologies. The role requires a strong technical background in silicon photonics, optical packaging, and hands-on experience in fiber-coupled device assembly
Job Summary
This role focuses on developing high-efficiency optical I/O module architectures and assembly processes for next-generation silicon photonics applications.
The engineer will define baseline assembly processes, select package BOMs, and establish optical coupling designs optimized for performance, reliability, yield, and cost.
Candidates must possess hands-on experience with fiber assembly using active and passive alignment tools and support the transition from concept to high-volume manufacturing.
Matching Summary
Match Score: 85
Apple is seeking a Silicon Photonics & Optical Packaging Engineer to develop innovative optical interconnect solutions for next-generation technologies. The role requires a strong technical background in silicon photonics, optical packaging, and hands-on experience in fiber-coupled device assembly.
Skills & Requirements
Must-have
Silicon photonics packaging development
Optical coupling design and manufacturing
Fiber-coupled device measurement experience
Active and passive alignment tool usage
CMOS BEOL wafer scale processing
Flip chip assembly (CoC, CoW, WLP)
Cross-functional team collaboration
Nice-to-have
Strong theoretical background in optics
Experience with laser and modulator devices
Vendor and foundry management skills
Passion for innovation and teamwork
Knowledge of Si WG and MUX/DeMUX components
Key Requirements
Minimum 5 years of relevant work experience
Bachelor's degree required; Master's or Ph.D. preferred
Degree in Physics, Electrical Engineering, Materials Science, or Mechanical Engineering
Hands-on experience with single/multi-mode fiber assembly