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The job posting is for a Senior TCB Application & Technical Sales Engineer at THE SUPREME HR ADVISORY PTE. LTD. in Singapore, focusing on engaging semiconductor customers to address their packaging needs and supporting technical sales. The ideal candidate should possess significant experience in semiconductor packaging and specific knowledge in Thermo Compression Bonding (TCB) and advanced packaging techniques.
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Job Summary
The role involves engaging semiconductor customers to understand packaging roadmaps and technical requirements while supporting advanced applications like HBM and CoWoS.
Candidates will lead machine qualification activities including FAT and SAT while defining alignment accuracy, thermal performance, and bond force profiles.
This position requires translating customer needs into internal specifications and troubleshooting complex bonding issues such as misalignment and delamination.
Matching Summary
Match Score: 75
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The job posting is for a Senior TCB Application & Technical Sales Engineer at THE SUPREME HR ADVISORY PTE. LTD. in Singapore, focusing on engaging semiconductor customers to address their packaging needs and supporting technical sales. The ideal candidate should possess significant experience in semiconductor packaging and specific knowledge in Thermo Compression Bonding (TCB) and advanced packaging techniques.
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Skills & Requirements
Must-have
Thermo Compression Bonding (TCB) experience
Flip Chip and Advanced Packaging knowledge
HBM CoWoS 2.5D 3D packaging expertise
Process parameter optimization and DOE
Troubleshooting bonding defects like voids
Machine qualification FAT SAT activities
Nice-to-have
Fluxless or N2 bonding environment experience
OSAT IDM or equipment environment background
Statistical analysis tools proficiency
Cross-functional team collaboration skills
Yield analysis and SPC methodology
Key Requirements
Bachelor's or Master's Degree in Engineering or Materials Science