Fab Module Engineer

Intel Corporation

Hillsboro, Oregon, US
Base: $76,390.00-107,840.00 usd; bonus/equity: sto...
Hybrid
Equipment and process optimization
Factory 300mm toolsets
Thick metal/via layers
The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly, driving Intel's advanced packaging strategy

Job Summary

  • The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly, driving Intel's advanced packaging strategy.
  • Responsibilities include owning factory toolsets, sustaining manufacturing processes, and delivering Model of Record tool performance through continuous improvement.
  • We offer competitive salary and financial benefits as well as programs that promote health and well-being.

Matching Summary

The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly, driving Intel's advanced packaging strategy.

Salary

Base: $76,390.00-107,840.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Equipment and process optimization
  • Factory 300mm toolsets
  • Thick metal/via layers
  • Bumping, reflow, thinning
  • Backside metallization
  • Excursion prevention and response

Nice-to-have

  • High-performing culture
  • Execution with urgency
  • Data-driven problem solving
  • Dynamic and ambiguous environment
  • Teamwork and leadership skills

Key Requirements

  • Bachelor's Degree in STEM field
  • Knowledge of statistics and experimental design
  • Strong data analysis and presentation acumen
  • Technical and troubleshooting skills
  • Ability to work across organizational boundaries
  • Excellent teamwork and leadership skills

Work Rights

Not specified

Tailored Resume

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