Lead the development and deployment of Intel's advanced chip packaging process technology focusing on inspection technologies across assembly, test, and finish processes
Job Summary
Lead the development and deployment of Intel's advanced chip packaging process technology focusing on inspection technologies across assembly, test, and finish processes.
Establish metrology and defect inspection capabilities to accelerate process development and ensure effective outgoing quality screening aligned with the company roadmap.
Drive improvements in quality, reliability, cost, yield, process stability, productivity and safety/ergonomics.
Matching Summary
Lead the development and deployment of Intel's advanced chip packaging process technology focusing on inspection technologies across assembly, test, and finish processes.
Skills & Requirements
Must-have
Inspection process recipe development
Material interaction understanding
Product FMEA engagement
New inspection capability assessment
AID and ML model development
Hardware/software upgrade testing
Nice-to-have
Collaboration with cross-functional teams
Continuous improvement mindset
Adaptability to changing requirements
Key Requirements
Bachelor's or Master's degree in Engineering, Physics, Computer Science, or related STEM field
Fundamental physical processes troubleshooting
Optical, laser, motion, or electrical systems expertise
Optics fundamentals for imaging techniques
Statistical principles, SPC, and DOE understanding
Novel design solutions for high volume manufacturing