Sr. Staff Engineer, Package Engineering

Marvell

Hsinchu City, Taiwan
Npi package development
Flip-chip package development
Cross-functional teamwork
Marvell’s semiconductor solutions are essential building blocks of data infrastructure

Job Summary

  • Marvell’s semiconductor solutions are essential building blocks of data infrastructure.
  • The package engineering team drives semiconductor IC package development from concept to mass production.
  • You will work on new projects and cutting-edge technologies.

Matching Summary

Marvell’s semiconductor solutions are essential building blocks of data infrastructure.

Skills & Requirements

Must-have

  • NPI package development
  • flip-chip package development
  • cross-functional teamwork

Nice-to-have

  • good communication skills
  • leadership abilities
  • program management skills

Key Requirements

  • Bachelor’s degree in engineering
  • 5-10 years of experience
  • knowledge of 2.5D and 3D packaging

Work Rights

Not specified

Tailored Resume

Cover Letter