(高雄)客製化記憶體製程開發與整合工程師

winbond

高雄, Taiwan
On-site
3dic tsv development experience
Eda tool experience
Layout design rule (ldr) knowledge
The role involves integrating and executing tasks related to customized memory product tape out

Job Summary

  • The role involves integrating and executing tasks related to customized memory product tape out.
  • Candidates will establish specifications for new technology masks and coordinate pre-production activities.
  • The company offers competitive salaries and benefits to ensure employee quality of life.

Matching Summary

The role involves integrating and executing tasks related to customized memory product tape out.

Skills & Requirements

Must-have

  • 3DIC TSV development experience
  • EDA tool experience
  • Layout Design Rule (LDR) knowledge

Nice-to-have

  • Experience with tape out processes
  • Strong English communication skills
  • Ability to coordinate development

Key Requirements

  • Master's degree required
  • 3+ years of relevant experience
  • Intermediate English proficiency

Work Rights

Not specified

Tailored Resume

Cover Letter