Thin Film Module Engineer

onsemi

Hopewell Junction, NY, US
Base: $114,000 to $193,700; bonus/equity: not spec...
Cvd and pvd processes
Amat and lam equipment
300mm silicon wafers
Develop and support the manufacturing of 300mm silicon wafers for Automotive and Consumer applications

Job Summary

  • Develop and support the manufacturing of 300mm silicon wafers for Automotive and Consumer applications.
  • Own critical CVD and PVD processes and associated equipment health in a fast-paced manufacturing environment.
  • Apply technical skills to implement equipment and process improvements that increase product performance, reduce cost, and increase throughput and yield.

Matching Summary

Develop and support the manufacturing of 300mm silicon wafers for Automotive and Consumer applications.

Salary

Base: $114,000 to $193,700; Bonus/Equity: Not specified; Benefits: Competitive benefits package

Skills & Requirements

Must-have

  • CVD and PVD processes
  • AMAT and LAM equipment
  • 300mm silicon wafers
  • Automotive and Consumer applications
  • statistical process control (SPC) techniques

Nice-to-have

  • team-based environment
  • results-oriented
  • data analysis and statistical process control
  • FMEA risk analysis

Key Requirements

  • BS degree in Engineering or technical field
  • 7+ years semiconductor processing experience
  • Intermediate Excel or JMP data analysis skills
  • Proficiency in Microsoft Office

Work Rights

Not specified

Tailored Resume

Cover Letter