Detector Test Wire Bonding Technician

Teledyne Technologies Incorporated

Base: $44,500.00-$59,300.00; bonus/equity: not spe...
Not specified (assumed on-site based on job responsibilities)
Manual wire bonder operation experience
Visual inspection under microscope
Semiconductor or microelectronics manufacturing
Teledyne Technologies is seeking a Detector Test Wire Bonding Technician to join their team, focusing on manufacturing infrared sensors for significant clients like NASA and the US Department of Defense. The ideal candidate will have hands-on experience in a cleanroom or manufacturing environment, along with strong attention to detail and the ability to work collaboratively

Job Summary

  • Join a mission-focused team providing infrared sensors for space missions including NASA and the James Webb Space Telescope.
  • The role involves executing detailed work orders to mount detector test chips and perform precise wire bonding using manual equipment.
  • Candidates receive a competitive salary package with health benefits from day one, 401(k) matching, and tuition reimbursement.

Matching Summary

Match Score: 75

Teledyne Technologies is seeking a Detector Test Wire Bonding Technician to join their team, focusing on manufacturing infrared sensors for significant clients like NASA and the US Department of Defense. The ideal candidate will have hands-on experience in a cleanroom or manufacturing environment, along with strong attention to detail and the ability to work collaboratively.

Salary

Base: $44,500.00-$59,300.00; Bonus/Equity: Not specified; Benefits: Health, Dental, Vision, Life Insurance, 401(k) Match, Tuition Reimbursement

Skills & Requirements

Must-have

  • Manual wire bonder operation experience
  • Visual inspection under microscope
  • Semiconductor or microelectronics manufacturing
  • Cleanroom environment work experience
  • Solvent cleaning and component handling

Nice-to-have

  • Collaborative team-oriented mindset
  • Willingness to crosstrain on test operations
  • Strong attention to quality and precision
  • Experience with MES systems
  • Ability to resolve die selection issues

Key Requirements

  • US citizenship required due to access restrictions
  • HS Diploma with 5 years of experience OR Associate's degree with 3 years
  • Hands-on experience in semiconductor or microelectronics manufacturing
  • Ability to follow written work instructions and diagrams

Work Rights

Must have US citizenship

Tailored Resume

Cover Letter