Sr Engineer, Package Pre Stacking

Micron

Taichung, Taiwan
Hybrid
3+ years package process experience
Familiar with dicing tools
Experience with wafer dicing techniques
Micron Technology is a world leader in innovating memory and storage solutions

Job Summary

  • Micron Technology is a world leader in innovating memory and storage solutions.
  • The role involves advanced package technology research and development for HBM products.
  • Candidates are encouraged to use AI tools to enhance their application materials.

Matching Summary

Micron Technology is a world leader in innovating memory and storage solutions.

Skills & Requirements

Must-have

  • 3+ years package process experience
  • Familiar with dicing tools
  • Experience with wafer dicing techniques

Nice-to-have

  • Problem solving skills
  • Familiarity with SPC and JMP
  • Experience with external suppliers

Key Requirements

  • Understanding of advanced package technology
  • Dicing tape evaluation experience

Work Rights

Not specified

Tailored Resume

Cover Letter