Silicon Photonics Module Packaging Integration Engineer (2026 New College Graduate)

GlobalFoundries

New York, United States
Base: $65,400.00 - $145,800.00; bonus/equity: not ...
Hybrid
Hands-on packaging assembly integration
Electro-optical transceiver delivery
Process integration specifications
GlobalFoundries is a leading semiconductor foundry providing design and fabrication services

Job Summary

  • GlobalFoundries is a leading semiconductor foundry providing design and fabrication services.
  • The role focuses on delivering advanced packaging solutions for optical interconnects.
  • New college graduates receive mentorship and networking opportunities for career development.

Matching Summary

GlobalFoundries is a leading semiconductor foundry providing design and fabrication services.

Salary

Base: $65,400.00 - $145,800.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Hands-on packaging assembly integration
  • Electro-optical transceiver delivery
  • Process integration specifications

Nice-to-have

  • Strong foundation in materials science
  • Demonstrated leadership experience
  • Project management skills

Key Requirements

  • Master’s or PhD in Electrical Engineering
  • Internship or research experience in Photonics
  • Minimum overall GPA of 3.0

Work Rights

Not specified

Tailored Resume

Cover Letter