Develop design & verification methodology, lead technical team, drive standards across organization, vendors and technical focus on EMAG, thermal & package flows for multi-die systems
Job Summary
Develop design & verification methodology, lead technical team, drive standards across organization, vendors and technical focus on EMAG, thermal & package flows for multi-die systems.
Partner with EDA vendors and internal PDK, design teams for EDA development flows and lead heterogeneous integration flows development and training.
Collaborate with product line management, marketing, and cross-geo, cross-functional teams to scope customer requirements and communicate resolutions.
Matching Summary
Develop design & verification methodology, lead technical team, drive standards across organization, vendors and technical focus on EMAG, thermal & package flows for multi-die systems.
Skills & Requirements
Must-have
3D-IC methodology development
design & verification methodology
technical team leadership
EMAG, thermal & package flows
EDA tool and flow expertise
Unix environment proficiency
Nice-to-have
mentoring junior colleagues
collaboration with vendors
project management skills
Java coding interest
GenAI coursework interest
Key Requirements
15+ years of relevant industry experience
10+ years of IP design enablement experience
Bachelor of Engineering or equivalent degree
Expertise in methodology design and model verification of RF, AMS, silicon photonics & packaging design