Senior Or Principal Technical Program Manager

The University of Texas at Austin

AUSTIN, TX, US
Base: industry-competitive salaries; bonus/equity:...
**
Advanced packaging technologies
Heterogeneous integration techniques
Semiconductor fabrication processes
** The University of Texas at Austin is seeking a Senior or Principal Technical Program Manager to lead multi-disciplinary initiatives in microsystems technology at the Texas Institute for Electronics. The ideal candidate should have extensive experience in semiconductor packaging and program management, with a strong focus on advanced packaging technologies. **

Job Summary

  • Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.
  • This role leads complex multi-disciplinary initiatives that drive innovation in microsystems technology by orchestrating collaboration across internal teams and external partners.
  • UT Austin provides outstanding employee benefits and total rewards packages that include competitive health benefits, generous paid time off, and a defined benefit retirement plan.

Matching Summary

Match Score: 75

** The University of Texas at Austin is seeking a Senior or Principal Technical Program Manager to lead multi-disciplinary initiatives in microsystems technology at the Texas Institute for Electronics. The ideal candidate should have extensive experience in semiconductor packaging and program management, with a strong focus on advanced packaging technologies. **

Salary

Base: Industry-Competitive Salaries; Bonus/Equity: Not specified; Benefits: Competitive health benefits, generous paid vacation, sick time, and holidays, TRS retirement plan

Skills & Requirements

Must-have

  • advanced packaging technologies
  • heterogeneous integration techniques
  • semiconductor fabrication processes
  • electronic design automation (EDA) flows
  • metrics-based accountability
  • proactive issue resolution

Nice-to-have

  • startup DNA
  • energized by ambiguity
  • act with urgency
  • take ownership of outcomes
  • fast-paced dynamic environment

Key Requirements

  • 8+ years semiconductor packaging experience (Senior)
  • 10+ years semiconductor packaging experience (Principal)
  • BS in Electrical Engineering or related technical discipline
  • Proven expertise in advanced packaging technologies
  • Working knowledge of semiconductor fabrication processes
  • Exceptional communication skills
  • Startup DNA
  • Execution mindset

Work Rights

Not specified

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