Intel's Advanced Packaging Technology Manufacturing (APTM) group is driving the next generation of semiconductor packaging solutions with groundbreaking technologies
Job Summary
Intel's Advanced Packaging Technology Manufacturing (APTM) group is driving the next generation of semiconductor packaging solutions with groundbreaking technologies.
Responsibilities include test technology development, process integration, equipment solutions, and feasibility studies for high-mix, low-volume testing.
The role involves implementing sophisticated test processes, repair reverse engineering, and collaborating with suppliers to develop enabling elements of technology.
Matching Summary
Intel's Advanced Packaging Technology Manufacturing (APTM) group is driving the next generation of semiconductor packaging solutions with groundbreaking technologies.