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The Supreme HR Advisory Pte. Ltd. is seeking a Senior TCB Equipment Application Engineer to engage with semiconductor customers and support various technical sales and engineering activities. The ideal candidate should have extensive experience in semiconductor packaging and TCB processes, with a competitive salary range of SGD 7,000 to SGD 10,000 per month.
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Job Summary
The role involves engaging semiconductor customers to understand packaging roadmaps, process requirements, and yield challenges while supporting technical sales activities.
Candidates will develop and optimize TCB process parameters for advanced packaging applications including HBM, CoWoS, and Chiplet Integration.
The position requires leading machine qualification activities and acting as the internal customer during equipment development with cross-functional teams.
Matching Summary
Match Score: 75
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The Supreme HR Advisory Pte. Ltd. is seeking a Senior TCB Equipment Application Engineer to engage with semiconductor customers and support various technical sales and engineering activities. The ideal candidate should have extensive experience in semiconductor packaging and TCB processes, with a competitive salary range of SGD 7,000 to SGD 10,000 per month.
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Salary
Base: SGD 7,000 – SGD 10,000/month; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Thermo Compression Bonding (TCB) experience
Advanced packaging applications support
Process parameter optimization and DOE
Customer technical requirement translation
Troubleshooting bonding defects
Nice-to-have
Fluxless or N2 bonding environment knowledge
Experience in OSAT or IDM environments
Statistical analysis tools proficiency
Cross-functional team collaboration skills
Key Requirements
Bachelor's or Master's Degree in Engineering or Materials Science
5–15 years of semiconductor packaging experience
Hands-on experience in TCB and Flip Chip processes
Strong understanding of thermal management and alignment systems