Principal Advanced Packaging Design Engineer

Marvell Technology

Base: not specified; bonus/equity: not specified; ...
Not specified
15+ years substrate or board design experience
Cadence 3dic isp apd sip tool mastery
Advanced 2.5d and 3d package technology knowledge
Marvell Technology is seeking a Principal Advanced Packaging Design Engineer to lead the development of innovative packaging solutions for high-performance computing and AI applications. The ideal candidate will have extensive experience in substrate and board design, and a strong background in advanced packaging technologies

Job Summary

  • The engineer will lead small project teams to deliver innovative high-quality packaging solutions for next-generation HPC and AI systems.
  • Marvell offers comprehensive benefits including an employee stock purchase plan, family support programs, and robust mental health resources.
  • This role requires extensive experience in substrate design and the ability to make trade-off decisions regarding manufacturability and performance.

Matching Summary

Match Score: 85

Marvell Technology is seeking a Principal Advanced Packaging Design Engineer to lead the development of innovative packaging solutions for high-performance computing and AI applications. The ideal candidate will have extensive experience in substrate and board design, and a strong background in advanced packaging technologies.

Salary

Base: Not specified; Bonus/Equity: Not specified; Benefits: Employee stock purchase plan, family support, mental health resources

Skills & Requirements

Must-have

  • 15+ years substrate or board design experience
  • Cadence 3DIC ISP APD SiP tool mastery
  • Advanced 2.5D and 3D package technology knowledge
  • Signal and power integrity expertise at system level
  • HBM DDR SerDes D2D D2H ADC DAC PCIE Ethernet experience

Nice-to-have

  • Experience contributing to tool process flow development
  • Ability to manage cross-functional global teams
  • Strong interpersonal skills and willingness to learn
  • Familiarity with running signal and power simulations

Key Requirements

  • Bachelor's degree plus 15+ years experience OR Master's plus 12+ years OR PhD plus 8+ years
  • Eligibility to access export-controlled information under US law
  • Proven ability to lead complex package architecture projects

Work Rights

Must be eligible to access export-controlled information (US citizens, lawful permanent residents, or protected individuals)

Tailored Resume

Cover Letter