Packaging Module Development Engineer

Intel Retiree Medical Plan Trust

Phoenix, Arizona, United States
Base: $115,110.00-219,550.00 usd annually; bonus/e...
Hybrid
Phd or master's in engineering
Mechanical design experience
Equipment development background
The role involves developing advanced packaging technologies including FLI/SLI and thermal solutions for mobile, edge, and hyperscale computing platforms

Job Summary

  • The role involves developing advanced packaging technologies including FLI/SLI and thermal solutions for mobile, edge, and hyperscale computing platforms.
  • Candidates must manage equipment development paths, new equipment definition, and technology scaling for high-volume manufacturing environments.
  • Intel offers a competitive total compensation package including stock bonuses, health benefits, retirement plans, and vacation time.

Matching Summary

The role involves developing advanced packaging technologies including FLI/SLI and thermal solutions for mobile, edge, and hyperscale computing platforms.

Salary

Base: $115,110.00-219,550.00 USD annually; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • PhD or Master's in Engineering
  • Mechanical design experience
  • Equipment development background
  • Hands-on laboratory experience
  • Semiconductor manufacturing knowledge

Nice-to-have

  • Technical leadership skills
  • Ability to coach teams
  • Tolerance for ambiguity
  • Strong communication skills
  • Experience in matrixed organizations

Key Requirements

  • PhD or Master's degree in Engineering or Physics
  • Minimum 1+ years of relevant experience
  • First-author publication for PhD candidates
  • Regular onsite presence required

Work Rights

Not specified

Tailored Resume

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