Engineer, Process Development (Core Engineering Module)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore
Not specified
Bachelor's degree in engineering discipline
0-2 years experience in semiconductor packaging
Strong data analysis and statistical skills
Micron Semiconductor Asia Operations is seeking a Process Development Engineer to improve efficiency and quality in semiconductor packaging and assembly processes. The ideal candidate should possess a Bachelor’s degree in engineering, demonstrate strong analytical and leadership skills, and have a keen interest in the semiconductor industry

Job Summary

  • The role focuses on ensuring excellent execution of assembly processes for New Product Introduction (NPI) success and smooth transfer to High Volume Manufacturing.
  • Candidates will act as Process Owners responsible for continuous improvement on process yield, defect elimination, and process characterization using statistical analysis.
  • The position requires frequent engagement with equipment and material suppliers to understand market trends and ensure key process technology capability enablement.

Matching Summary

Match Score: 75

Micron Semiconductor Asia Operations is seeking a Process Development Engineer to improve efficiency and quality in semiconductor packaging and assembly processes. The ideal candidate should possess a Bachelor’s degree in engineering, demonstrate strong analytical and leadership skills, and have a keen interest in the semiconductor industry.

Skills & Requirements

Must-have

  • Bachelor's degree in Engineering discipline
  • 0-2 years experience in semiconductor packaging
  • Strong data analysis and statistical skills
  • Knowledge of FMEA, SPC, and QCP methodologies
  • Ability to support NPI to HVM transfer

Nice-to-have

  • Leadership roles in academic or sports councils
  • Internship experience in the semiconductor industry
  • Interest in AI-enabled tools and continuous learning
  • Experience with Design for Manufacturing (DFM)
  • Track record of demonstrating leadership impact

Key Requirements

  • Minimum Bachelor's degree in Engineering
  • 0-2 years experience in semiconductor packaging
  • Fresh graduates encouraged to apply

Work Rights

Not specified

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