2025 Intern - Packaging Engineer

NXP USA INC.

Tianjin, China
Ic packaging technology research
Independent r&d capability
Cross-functional team collaboration
This position focuses on IC packaging technology research and development

Job Summary

  • This position focuses on IC packaging technology research and development.
  • The intern will work with a global team to complete development projects.
  • Candidates should have the intention and capability to work in a cross-functional environment.

Matching Summary

This position focuses on IC packaging technology research and development.

Skills & Requirements

Must-have

  • IC packaging technology research
  • independent R&D capability
  • cross-functional team collaboration

Nice-to-have

  • communication among global teams
  • advanced material interface study

Key Requirements

  • pursuing master's degree
  • CET-4 or equivalent English level
  • CET-6 preferred

Work Rights

Not specified

Tailored Resume

Cover Letter