Job Summary

• This position is a packaging back-end R&D intern focusing on IC packaging technology research and development.
• The role involves coordinating and leading development projects independently while cooperating with global teams across the US, Europe, Malaysia, Japan, and France.
• Candidates must be pursuing a master's degree in Metallic Materials Engineering, Polymer Materials Engineering, or Mechanical Engineering and Automation.

Matching Summary

Skills & Requirements

Key Requirements

• Pursuing Master's degree
• Major in Metallic/Polymer/Mechanical Engineering
• CET-4 English level required
• CET-6 English level preferred

Work Rights