Senior Manager, Semi Packaging Engineering

Analog Devices Foundation

Base: $148,800 to $204,600; bonus: discretionary p...
Not specified (assumed to be hybrid based on industry standards).
15+ years semiconductor packaging experience
3+ years people leadership experience
Mems and rf module integration expertise
Analog Devices, Inc. is seeking a Senior Manager for Semiconductor Packaging Engineering to lead the packaging strategy for MEMS and RF modules. The role requires extensive experience in semiconductor packaging, team leadership, and cross-functional collaboration to deliver effective packaging solutions

Job Summary

  • This role is accountable for building and leading a high-performing team of individual contributors to deliver reliable, scalable, and cost-effective module packaging solutions.
  • The position requires driving the MEMS and RF module packaging technology roadmap aligned with product and business roadmaps from concept through high-volume manufacturing.
  • Candidates will establish and govern OSAT/vendor engagement models including capability assessments, process readiness, yield improvement, and change control.

Matching Summary

Match Score: 85

Analog Devices, Inc. is seeking a Senior Manager for Semiconductor Packaging Engineering to lead the packaging strategy for MEMS and RF modules. The role requires extensive experience in semiconductor packaging, team leadership, and cross-functional collaboration to deliver effective packaging solutions.

Salary

Base: $148,800 to $204,600; Bonus: Discretionary performance-based bonus available; Benefits: Medical, vision, dental, 401k, paid vacation, holidays, sick time

Skills & Requirements

Must-have

  • 15+ years semiconductor packaging experience
  • 3+ years people leadership experience
  • MEMS and RF module integration expertise
  • OSAT and external supplier governance
  • Cross-functional program management

Nice-to-have

  • Design-to-cost optimization skills
  • Strong technical communication abilities
  • Experience with failure analysis tools

Key Requirements

  • Master's degree or PhD in Engineering or Materials Science
  • 15+ years in semiconductor packaging and assembly engineering
  • 3+ years of people leadership experience
  • US Citizenship or Permanent Resident status required for export control

Work Rights

Must have US citizenship, US Permanent Resident, or protected individual status

Tailored Resume

Cover Letter