Package Design Engineer

Teledyne e2v Semiconductors SAS

Saint-Egrève, France
Experience in packaging design
Mastering of package design flow
Knowledge in thermal simulations
Teledyne Technologies provides enabling technologies for various industrial growth markets

Job Summary

  • Teledyne Technologies provides enabling technologies for various industrial growth markets.
  • The Package Design Engineer will lead the design flow of advanced microelectronic packages.
  • Join a team where innovation, human values, and work-life balance come together.

Matching Summary

Teledyne Technologies provides enabling technologies for various industrial growth markets.

Skills & Requirements

Must-have

  • Experience in packaging design
  • Mastering of package design flow
  • Knowledge in thermal simulations

Nice-to-have

  • Strong customer focus
  • Ability to adapt and communicate
  • Experience in imaging and assembly

Key Requirements

  • Background in microelectronics or electronics
  • First confirmed experience in packaging design
  • Good level of English and French

Work Rights

Not specified

Tailored Resume

Cover Letter