$154,000.00 - $212,000.00; not specified; not spec...
Hybrid
Wafer to wafer bonding
Complex heterogeneous wafer level packaging
Tsv
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world
Job Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.
We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company.
Matching Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
Salary
$154,000.00 - $212,000.00; Not specified; Not specified
Skills & Requirements
Must-have
wafer to wafer bonding
complex heterogeneous wafer level packaging
TSV
die to wafer bonding
advanced substrate and chip on wafer stacking
thermal management
engineering plans
design DOEs
characterize and create engineering reports
Nice-to-have
supportive work culture
learn, develop, and grow career
push the boundaries of what is possible
self-starter
team player
work independently with minimal supervision
Key Requirements
MS or PhD in Electrical, Mechanical Engineering, Material Engineering or equivalent