Packaging Module Development Engineer

Intel Retiree Medical Plan Trust

Phoenix, Arizona, United States
Base: $155,520.00-255,200.00 usd; bonus/equity: st...
Computational mechanics expertise
Fea software experience
Mechanical modeling
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies

Job Summary

  • The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies.
  • The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by providing mechanical modeling support for a variety of R&D projects.
  • We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs.

Matching Summary

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies.

Salary

Base: $155,520.00-255,200.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • computational mechanics expertise
  • FEA software experience
  • mechanical modeling
  • thermo-mechanical modeling
  • semiconductor packaging technologies

Nice-to-have

  • solid mechanics theory
  • fluid mechanics theory
  • experimental mechanics understanding
  • semiconductor fabrication processes

Key Requirements

  • Ph.D. degree in STEM field
  • 8+ years computational mechanics
  • 8+ years FEA software

Work Rights

Not specified

Tailored Resume

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