Senior Program Manager

Intel

Tokyo, Japan
Onsite
Advanced packaging substrate technology
Supplier capacity qualification
Process control system adherence
Work at the forefront of packaging technologies essential for next-generation AI devices

Job Summary

  • Work at the forefront of packaging technologies essential for next-generation AI devices.
  • Collaborate with substrate suppliers worldwide to drive innovation and scalability.
  • Lead efforts to qualify new capacity at advanced packaging suppliers, ensuring timely readiness to meet growing customer demand.

Matching Summary

Work at the forefront of packaging technologies essential for next-generation AI devices.

Skills & Requirements

Must-have

  • Advanced packaging substrate technology
  • Supplier capacity qualification
  • Process control system adherence
  • New factory startup micro-schedules
  • Production ramp-up monitoring

Nice-to-have

  • Thrive on solving complex challenges
  • Challenge conventional approaches
  • Build lasting supplier partnerships
  • Adapt to evolving project scopes

Key Requirements

  • Bachelor's or Master's degree with 8+ years, or PhD with 4+ years work experience
  • 6+ years of experience in fab back-end or substrate manufacturing process development
  • Fluent business-level English communication skills

Work Rights

Not specified

Tailored Resume

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