Packaging Module Process Development Engineer

Intel

Phoenix, Arizona, United States
Base: $133,800.00-188,890.00 usd; bonus/equity: st...
Statistical process controls (spc)
Fmea and/or doe experience
Semiconductor fabrication related experience
This role is responsible for advancing packaging process development through the application of novel concepts to enable future assembly packaging platform technologies

Job Summary

  • This role is responsible for advancing packaging process development through the application of novel concepts to enable future assembly packaging platform technologies.
  • The candidate will optimize manufacturing efficiency while ensuring quality, reliability, cost, yield, and productivity requirements are met.
  • Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting customers with cutting-edge silicon process and packaging technology leadership.

Matching Summary

This role is responsible for advancing packaging process development through the application of novel concepts to enable future assembly packaging platform technologies.

Salary

Base: $133,800.00-188,890.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • Statistical process controls (SPC)
  • FMEA and/or DOE experience
  • Semiconductor fabrication related experience

Nice-to-have

  • Experience with dispense and material development
  • Product ownership and change control management
  • Project management for time critical projects

Key Requirements

  • Bachelor's degree in engineering with 6+ years experience
  • Master's degree in engineering with 4+ years experience
  • PhD degree in engineering with 2+ years experience

Work Rights

Not specified

Tailored Resume

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