Principal Engineer Advanced Package Technology Development
MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.
Boise, Idaho, United States
Not specified; not specified; comprehensive benefi...
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High bandwidth memory expertise
2.5d integration knowledge
3d integration strategies including hybrid bonding
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Micron Semiconductor Asia Operations is seeking a Principal Engineer for their Advanced Package Technology Development team in Boise, Idaho. The role involves driving technical innovation in semiconductor packaging, influencing strategic decisions, and collaborating with cross-functional teams to enhance technology integration and competitive advantage.
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Job Summary
This role involves leading the development of differentiated technology solutions to drive business value and strategic success.
The successful candidate will guide packaging technology roadmaps while collaborating with internal and external partners for seamless integration.
Micron offers comprehensive benefits including healthcare, retirement savings, tuition reimbursement, and professional development training.
Matching Summary
Match Score: 75
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Micron Semiconductor Asia Operations is seeking a Principal Engineer for their Advanced Package Technology Development team in Boise, Idaho. The role involves driving technical innovation in semiconductor packaging, influencing strategic decisions, and collaborating with cross-functional teams to enhance technology integration and competitive advantage.
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Salary
Not specified; Not specified; Comprehensive benefits include Healthcare, Paid time off, Retirement savings plans, Tuition Reimbursement
Skills & Requirements
Must-have
High Bandwidth Memory expertise
2.5D integration knowledge
3D integration strategies including Hybrid bonding
Wafer Level Packaging process engineering
3D stacking process experience
DRAM manufacturing background
OSAT company experience
Nice-to-have
Understanding of DRAM wafer structure
Patent inventions or published literature
Passion for innovation
Strategic decision influence at senior levels
Multi-disciplinary team leadership
Key Requirements
Over 5 years of professional experience in semiconductor advanced packaging
BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field
Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking
Experience in DRAM manufacturing and OSAT companies