Advanced Packaging BD Manager

Taiwan Semiconductor Manufacturing Company Limited

Taipei, Taiwan
On-site
Advanced packaging technology knowledge
3dic technology roadmap development
Customer engagement for new business
The Taiwan Semiconductor Manufacturing Company (TSMC) is seeking an Advanced Packaging BD Manager in Taipei, Taiwan, to drive business development in advanced packaging technologies. The ideal candidate will have extensive experience in the semiconductor industry and be proficient in both Chinese and English

Job Summary

  • The role requires developing a comprehensive 3DIC technology roadmap and long-term demand forecast to drive business growth.
  • Candidates must possess in-depth knowledge of advanced packaging and chip stacking technologies to engage customers effectively.
  • TSMC fosters a global inclusive workplace where every employee is valued regardless of background to drive innovation and profitability.

Matching Summary

Match Score: 85

The Taiwan Semiconductor Manufacturing Company (TSMC) is seeking an Advanced Packaging BD Manager in Taipei, Taiwan, to drive business development in advanced packaging technologies. The ideal candidate will have extensive experience in the semiconductor industry and be proficient in both Chinese and English.

Skills & Requirements

Must-have

  • Advanced packaging technology knowledge
  • 3DIC technology roadmap development
  • Customer engagement for new business
  • Cross-team project leadership
  • Chinese and English proficiency

Nice-to-have

  • Aggressive business development mindset
  • Supply chain influence experience
  • Global inclusive workplace values
  • Logical thinking capabilities

Key Requirements

  • M.S. degree or above in engineering
  • 15 years and above of related experience
  • Experience in advance packaging design or process integration
  • Proficient in both Chinese and English

Work Rights

Not specified

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