Manager, Package Design Engineering

Astera Labs

San Jose, United States
Base: $230,000 usd – $265,000 usd; bonus/equity: n...
On-site
Ic package design
Advanced ic packaging solutions
Chiplet-based designs
Lead and scale our Package Design team in San Jose, owning the end-to-end delivery of advanced IC packaging solutions

Job Summary

  • Lead and scale our Package Design team in San Jose, owning the end-to-end delivery of advanced IC packaging solutions.
  • Build and mentor a high-performing team while driving cross-functional execution with silicon architecture, SIPI, PCB, validation, and manufacturing.
  • Shape design methodology, establish scalable standards, and enable chip-package-board co-design frameworks across multiple product lines.

Matching Summary

Lead and scale our Package Design team in San Jose, owning the end-to-end delivery of advanced IC packaging solutions.

Salary

Base: $230,000 USD – $265,000 USD; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • IC package design
  • advanced IC packaging solutions
  • chiplet-based designs
  • 2.5D/3D integration
  • high-speed SerDes systems
  • substrate technologies

Nice-to-have

  • design methodology
  • scalable standards
  • chip-package-board co-design
  • automation flows
  • technology roadmaps

Key Requirements

  • Bachelor's degree in Electrical Engineering, Materials Science, or related field
  • 10+ years of progressive experience in IC package design
  • 5+ years of leadership experience
  • Proven delivery of HVM-ready FCBGA/FCCSP packages
  • Experience with high-speed SerDes systems (PCIe Gen5/6/7, CXL, Ethernet 100G/200G/400G+)
  • Experience with advanced nodes (7nm, 5nm, 3nm)
  • Experience with advanced packaging architectures

Work Rights

Not specified

Tailored Resume

Cover Letter