Customer Enabling Engineer

Intel

Phoenix, Arizona, US
Base: $248,400.00-350,690.00 usd; bonus/equity: st...
Hybrid
Package design and development expertise
Wafer and package testing proficiency
Statistical methods and reliability modeling
The role involves leading innovation in Intel's cutting-edge assembly packaging technologies to ensure high-quality product delivery

Job Summary

  • The role involves leading innovation in Intel's cutting-edge assembly packaging technologies to ensure high-quality product delivery.
  • Candidates must possess demonstrated expertise in package design, manufacturing quality assurance, and process characterization with extensive testing experience.
  • Intel offers a competitive total compensation package including stock bonuses, health benefits, and retirement programs.

Matching Summary

The role involves leading innovation in Intel's cutting-edge assembly packaging technologies to ensure high-quality product delivery.

Salary

Base: $248,400.00-350,690.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation

Skills & Requirements

Must-have

  • Package design and development expertise
  • Wafer and package testing proficiency
  • Statistical methods and reliability modeling
  • 12+ years packaging technology experience
  • Bachelor's degree in engineering field

Nice-to-have

  • Strong mentoring and coaching skills
  • Exceptional communication and influence
  • Industry recognition for innovation
  • Strategic problem-solving abilities
  • Learning agility in changing environments

Key Requirements

  • 12+ years experience with Bachelor's degree
  • 8+ years experience with Master's degree
  • 6+ years experience with PhD
  • Bachelor's in Materials Science or Engineering
  • Position of Trust background check required

Work Rights

Not specified

Tailored Resume

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