Advanced Lead – Sic/gan Power Module Packaging Engineer
GE AEROSPACE
Pompano Beach, FL, US
Base: $112,000-150,000; bonus: eligible for annual...
Onsite
Master's degree in engineering or materials science
3+ years semiconductor manufacturing experience
Power module packaging process development
This role focuses on designing and optimizing manufacturing processes for advanced Gallium Nitride (GaN) and Silicon Carbide (SiC) power modules critical for high-efficiency aviation systems
Job Summary
This role focuses on designing and optimizing manufacturing processes for advanced Gallium Nitride (GaN) and Silicon Carbide (SiC) power modules critical for high-efficiency aviation systems.
The successful candidate will collaborate with design teams to ensure manufacturability while implementing quality control procedures to meet industry standards.
GE Aerospace offers a comprehensive benefits package including medical insurance, a generous 401(k) plan with company matching, and tuition reimbursement.
Matching Summary
This role focuses on designing and optimizing manufacturing processes for advanced Gallium Nitride (GaN) and Silicon Carbide (SiC) power modules critical for high-efficiency aviation systems.
Salary
Base: $112,000-150,000; Bonus: Eligible for annual discretionary bonus based on base salary percentage; Benefits: Medical, dental, vision, 401(k), tuition reimbursement
Skills & Requirements
Must-have
Master's degree in Engineering or Materials Science
3+ years semiconductor manufacturing experience
Power module packaging process development
GaN and SiC technology expertise
Statistical process control (SPC) implementation
Nice-to-have
PhD in Electrical or Mechanical Engineering
Cross-functional team collaboration skills
Root cause analysis proficiency
Strong communication and problem-solving abilities
Key Requirements
Master's degree required
Minimum 3 years semiconductor manufacturing experience