Snr/staff Equipment Development Engineer (aptd)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Yishun, Singapore
Sgd 6,000 - 12,000 / monthly pm
On-site
Advanced packaging equipment development
Wafer-level packaging and stacking
Equipment capability improvement
Micron Semiconductor Asia Operations is seeking a Senior/Staff Equipment Development Engineer to develop and optimize advanced packaging equipment, focusing on wafer-level packaging and stacking. The ideal candidate will have extensive experience in semiconductor equipment engineering, with a strong emphasis on developing innovative solutions and improving process capabilities

Job Summary

  • The role involves leading equipment development and optimization to enable advanced semiconductor packaging technologies and improve manufacturing productivity and cost efficiency.
  • The engineer will collaborate closely with multiple internal teams and external partners to develop innovative solutions and ensure smooth transitions from product development to high volume production.
  • Micron Technology is an industry leader in memory and storage solutions, committed to innovation, operational excellence, and providing equal employment opportunities.

Matching Summary

Match Score: 85

Micron Semiconductor Asia Operations is seeking a Senior/Staff Equipment Development Engineer to develop and optimize advanced packaging equipment, focusing on wafer-level packaging and stacking. The ideal candidate will have extensive experience in semiconductor equipment engineering, with a strong emphasis on developing innovative solutions and improving process capabilities.

Salary

SGD 6,000 - 12,000 / Monthly

Skills & Requirements

Must-have

  • advanced packaging equipment development
  • wafer-level packaging and stacking
  • equipment capability improvement
  • process and equipment data analytics
  • equipment management and maintenance
  • collaboration with cross-functional teams

Nice-to-have

  • proficiency in Python, R, SQL
  • experience with Visual Basic automation
  • knowledge of MES, ETO, Autoshell, E3 FDC
  • strong problem-solving and root cause analysis
  • hardware strategic roadmap development

Key Requirements

  • B.S/M.S./Ph.D. in relevant technical fields
  • 5+ years semiconductor process or equipment engineering experience
  • experience in wafer bonding, plating, warpage control, packaging stacking process
  • familiarity with E3, FDC, RMS systems
  • strong data analytics skills for SPC, DOE, defect analysis
  • experience in equipment development for FOAK hardware

Work Rights

Not specified

Tailored Resume

Cover Letter